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Micrel Inc.
PCB LAYOUT RECOMMENDATIONS
PCB Considerations and Layout
Figures 19 to 22 below, show some of the printed
circuit layers for the QR221BPF board, refer to Figure
5. Use the Gerber files provided (downloadable from
the Micrel Website at: www.micrel.com ), which have
the remaining layers needed to fabricate this board.
When copying or making one’s own boards, make
traces as short as possible. Long traces alter the
matching network and the values suggested are no
longer valid. Suggested Matching Values may vary
due to PCB variations. A PCB trace 100 mills (2.5mm)
long has about 1.1nH inductance.
Optimization should always be done with exhaustive
range tests.
Make individual ground connections to the ground
plane with a VIA for each ground connection. Do not
share VIAs with ground connections. Each ground
connection = one or more VIAs. The ground plane
MICRF221
must be solid and, if possible, without interruptions.
Avoid a ground plane on the top layer next to the
matching element, as it will normally add additional
stray capacitance, which changes the matching.
Do not use phenolic material; use only FR4 or better
materials, since phenolic material is conductive above
200MHz.
The RF path should be as straight as possible,
avoiding loops and unnecessary turns.
Separate the ground and V DD lines from other circuits
(microcontroller, etc).
Known sources of noise should be positioned as far
as possible from the RF circuits.
Avoid thick traces. The higher the frequency, the
thinner the trace should be to minimize losses in the
RF path.
Figure 19. QR221BPF Top Layer
Figure 20. QR221BPF Bottom Layer, Mirror Image
October 2008
20
M9999-100108
(408) 955-1690
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